Surface chemical analysis — Sputter depth profiling — Optimization using layered systems as reference materials

Surface chemical analysis — Sputter depth profiling — Optimization using layered systems as reference materials

Surface chemical analysis — Sputter depth profiling — Optimization using layered systems as reference materials

Surface chemical analysis — Depth profiling — Measurement of sputtered depth

Surface chemical analysis — Depth profiling — Measurement of sputtered depth

Surface chemical analysis — Depth profiling — Methods for ion beam alignment and the associated measurement of current or current density for depth profiling in AES and XPS

Surface chemical analysis — Depth profiling — Methods for ion beam alignment and the associated measurement of current or current density for depth profiling in AES and XPS

Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films

Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films

Surface chemical analysis — Depth profiling — Measurement of sputtering rate: mesh-replica method using a mechanical stylus profilometer

Surface chemical analysis — Depth profiling — Non-destructive depth profiling of nanoscale heavy metal oxide thin films on Si substrates with medium energy ion scattering