ISO/DIS 9455-17
u
ISO/DIS 9455-17
84464

Abstract

 Preview

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.


General information 

  •  :  Under development
  •  : 2
     : 19
  •  : ISO/TC 44/SC 12 Soldering materials
  •  :
    25.160.50 Brazing and soldering

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std 1 58 PDF
std 2 58 Paper
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