International Standard
ISO 9455-17:2024
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Reference number
ISO 9455-17:2024
Edition 2
2024-01
International Standard
Read sample
ISO 9455-17:2024
84464
Published (Edition 2, 2024)

ISO 9455-17:2024

ISO 9455-17:2024
84464
Language
Format
CHF 129
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Abstract

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).

This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

General information

  •  : Published
     : 2024-01
    : International Standard published [60.60]
  •  : 2
     : 22
  • ISO/TC 44/SC 12
    25.160.50 
  • RSS updates

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