This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
Status: PublishedPublication date: 2023-01
Edition: 1Number of pages: 12
Technical Committee: ISO/TC 206 Fine ceramics
- ICS :
- 81.060.30 Advanced ceramics
This standard contributes to the following Sustainable Development Goals:
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ISO 4825-1:2023Stage: 60.60
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